Improvement Methods of High Power LED Display Heat Dissipation
Currently, many LEDs' drive current reached 70mA, 100mA even 1A which causes heat concentration inside the chip, luminous efficiency reduction, rapid aging of phospher and lifetime contraction. Many big efforts have been made to solve the heat dissipation problem. Even though, single LED product can only be 1-10w currently, cooling ability is eager to be improved. Many researches concentrate on looking for high heat conducting heat sink and encapsulation material, while, when the power reaches up to 10w, the research is stuck.
Thermal analysis of finite element theory is used to solve this problem. After several researches, experiments and analyses, the final conclusion comes out: Heat dissipation can't be infinitely improved by enlarging cooling area or increase convection speed.
The reason is that when the heat dissipation structure,method are settled, chip temperature can't be lowered in a wide margin even though LED heat conducting increases. It's proved that enlarging heat dissipation area can be helpful to heat dissipation. But due to the limit of cost, heat dissipating area can't be enlarged infinitely. The key point to improve LED heat dissipation is enlarging heat dissipating surface and changing heat dissipation method.